|Title of the article||
SIMULATION OF A POWDER MATERIAL DRY GRINDING PROCESS
Domkin Kirill Ivanovich, Postgraduate student, Penza State University, firstname.lastname@example.org
The authors introduce research results of dry milling of powder materials for thich-film and chip technologies. The researchers also determine charachterisitc time and type of destruction function, which are necessary for optimization of milling processes in mechanical devices.
dry milling, powder materials, thick-film and chip technologies.
Дата обновления: 17.07.2014 10:08